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  ? 2007 microchip technology inc. ds21812e-page 1 mcp6291/1r/2/3/4/5 features gain bandwidth product: 10 mhz (typical) supply current: i q = 1.0 ma supply voltage: 2.4v to 6.0v rail-to-rail input/output extended temperature range: -40c to +125c available in single, dual and quad packages single with cs ( mcp6293 ) dual with cs ( mcp6295 ) applications automotive portable equipment photodiode amplifier analog filters notebooks and pdas battery-powered systems design aids spice macro models filterlab ? software mindi? simulation tool maps (microchip advanced part selector) analog demonstration and evaluation boards application notes description the microchip technology inc. mcp6291/1r/2/3/4/5 family of operational amplifiers (op amps) provide wide bandwidth for the current. this family has a 10 mhz gain bandwidth product (gbwp) and a 65 phase margin. this family also operates from a single supply voltage as low as 2.4v, while drawing 1 ma (typical) quiescent current. in additi on, the mcp6291/1r/2/3/4/5 supports rail-to-rail input and output swing, with a common mode input voltage range of v dd + 300 mv to v ss C 300 mv. this family of operational amplifiers is designed with microchips advanced cmos process. the mcp6295 has a chip select (cs ) input for dual op amps in an 8-pin package. this device is manufactured by cascading the two op amps, with the output of op amp a being connected to the non-inverting input of op amp b. the cs input puts the device in a low-power mode. the mcp6291/1r/2/3/4/5 family operates over the extended temperature range of -40c to +125c. it also has a power supply range of 2.4v to 6.0v. package types 1 2 3 4 v in _ mcp6291 v dd 1 2 3 4 8 7 6 5 - + nc nc nc v in + v ss mcp6292 pdip, soic, msop mcp6294 1 2 3 4 14 13 12 11 - + - + 10 9 8 5 6 7 + - - + pdip, soic, tssop 1 2 3 4 8 7 6 5 - + - + v out mcp6293 8 7 6 5 - + v ina _ v ina + v ss v outa v outb v dd v inb _ v inb + v ss v in + v in _ nc cs v dd v out nc v outa v ina _ v ina + v dd v ss v outb v inb _ v inb + v outc v inc _ v inc + v outd v ind _ v ind + pdip, soic, msop pdip, soic, msop mcp6295 pdip, soic, msop 1 2 3 4 8 7 6 5 + - v ina _ v ina + v ss v outa /v inb + v outb v dd v inb _ cs - + mcp6291 sot-23-5 4 1 2 3 - + 5 v dd v in C v out v ss v in + mcp6291r sot-23-5 4 1 2 3 - + 5 v ss v in C v out v dd v in + mcp6293 sot-23-6 4 1 2 3 - + 6 5 v ss v in + v out cs v dd v in C 1.0 ma, 10 mhz rail-to-rail op amp downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 2 ? 2007 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings ? v dd Cv ss ........................................................................7.0v current at input pins .....................................................2 ma analog inputs (v in +, v in C) ?? ........ v ss C1.0vtov dd +1.0v all other inputs and outputs ......... v ss C 0.3v to v dd +0.3v difference input voltage ...................................... |v dd Cv ss | output short circuit current .................................continuous current at output and supply pins ............................30 ma storage temperature....................................C65c to +150c maximum junction temperature (t j ) ......................... .+150c esd protection on all pins (hbm; mm) .............. 4 kv; 400v ? notice: stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rati ng only and functional operation of the device at those or any other conditions above those indicated in the operational listi ngs of this specification is not implied. exposure to maximu m rating conditions for extended periods may affect device reliability. ?? see section 4.1.2 input voltage and current limits . dc electrical specifications electrical characteristics : unless otherwise indicated, t a = +25c, v dd = +2.4v to +5.5v, v ss =gnd, v out v dd /2, v cm =v dd /2, v l = v dd /2, r l =10k to v l and cs is tied low (refer to figure 1-2 and figure 1-3 ). parameters sym min typ max units conditions input offset input offset voltage v os -3.0 +3.0 mv v cm = v ss (note 1) input offset voltage (extended temperature) v os -5.0 +5.0 mv t a = -40c to +125c, v cm = v ss (note 1) input offset temperature drift v os / t a 1 . 7 v / ct a = -40c to +125c, v cm = v ss (note 1) power supply rejection ratio psrr 70 90 db v cm = v ss (note 1) input bias, input offset current and impedance input bias current i b 1.0 pa note 2 at temperature i b 50 200 pa t a = +85c (note 2) at temperature i b 2 5n at a = +125c (note 2) input offset current i os 1.0 pa note 3 common mode input impedance z cm 1 0 13 ||6 ||pf note 3 differential input impedance z diff 1 0 13 ||3 ||pf note 3 common mode (note 4) common mode input range v cmr v ss ? 0.3 v dd + 0.3 v common mode rejection ratio cmrr 70 85 db v cm = -0.3v to 2.5v, v dd = 5v common mode rejection ratio cmrr 65 80 db v cm = -0.3v to 5.3v, v dd = 5v open-loop gain dc open-loop gain (large signal) a ol 90 110 db v out = 0.2v to v dd C 0.2v, v cm =v ss (note 1) output maximum output voltage swing v ol , v oh v ss + 15 v dd C 15 mv 0.5v input overdrive output short circuit current i sc 2 5 m a power supply supply voltage v dd 2.4 6.0 v t a = -40c to +125c (note 5) quiescent current per amplifier i q 0.7 1.0 1.3 ma i o = 0 note 1: the mcp6295s v cm for op amp b (pins v outa /v inb + and v inb C) is v ss +100mv. 2: the current at the mcp6295s v inb C pin is specified by i b only. 3: this specification does not apply to the mcp6295s v outa /v inb + pin. 4: the mcp6295s v inb C pin (op amp b) has a common mode range (v cmr ) of v ss + 100 mv to v dd C 100 mv. the mcp6295s v outa /v inb + pin (op amp b) has a voltage range specified by v oh and v ol . 5: all parts with date codes november 2007 and la ter have been screened to ensure operation at v dd = 6.0v. however, the other minimum and maximum specifications are measured at 2.4v and or 5.5v. downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 3 mcp6291/1r/2/3/4/5 ac electrical specifications mcp6293/mcp6295 ch ip select (cs ) specifications electrical characteristics: unless otherwise indicated, t a = +25c, v dd = +2.4v to +5.5v, v ss = gnd, v cm = v dd /2, v out v dd /2, v l = v dd /2, r l = 10 k to v l , c l = 60 pf, and cs is tied low (refer to figure 1-2 and figure 1-3 ). parameters sym min typ max units conditions ac response gain bandwidth product gbwp 10.0 mhz phase margin at unity-gain pm 65 g = +1 v/v slew rate sr 7 v/s noise input noise voltage e ni 4 . 2 v p-p f = 0.1 hz to 10 hz input noise voltage density e ni 8 . 7n v / hz f = 10 khz input noise current density i ni 3f a / hz f = 1 khz electrical characteristics: unless otherwise indicated, t a = +25c, v dd = +2.4v to +5.5v, v ss = gnd, v cm =v dd /2, v out v dd /2, v l = v dd /2, r l = 10 k to v l , c l = 60 pf, and cs is tied low (refer to figure 1-2 and figure 1-3 ). parameters sym min typ max units conditions cs low specifications cs logic threshold, low v il v ss 0 . 2 v dd v cs input current, low i csl 0 . 0 1 ac s = v ss cs high specifications cs logic threshold, high v ih 0.8 v dd v dd v cs input current, high i csh 0 . 7 2 ac s = v dd gnd current per amplifier i ss - 0 . 7 ac s = v dd amplifier output leakage 0.01 a cs = v dd dynamic specifications (note 1) cs low to valid amplifier output, turn-on time t on 41 0 sc s low 0.2 v dd , g = +1 v/v, v in = v dd /2, v out = 0.9 v dd /2, v dd = 5.0v cs high to amplifier output high-z t off 0 . 0 1 sc s high 0.8 v dd , g = +1 v/v, v in = v dd /2, v out = 0.1 v dd /2 hysteresis v hyst 0 . 6 vv dd = 5v note 1: the input condition (v in ) specified applies to both op amp a and b of t he mcp6295. the dynamic specification is tested at the output of op amp b (v outb ). downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 4 ? 2007 microchip technology inc. temperature specifications figure 1-1: timing diagram for the chip select (cs ) pin on the mcp6293 and mcp6295. 1.1 test circuits the test circuits used for the dc and ac tests are shown in figure 1-2 and figure 1-2 . the bypass capacitors are laid out acco rding to the ru les discussed in section 4.6 supply bypass . figure 1-2: ac and dc test circuit for most non-inverting gain conditions. figure 1-3: ac and dc test circuit for most inverting gain conditions. electrical characteristics: unless otherwise indicated, v dd = +2.4v to +5.5v and v ss = gnd. parameters sym min typ max units conditions temperature ranges operating temperature range t a -40 +125 c note storage temperature range t a -65 +150 c thermal package resistances thermal resistance, 5l-sot-23 ja 256 c/w thermal resistance, 6l-sot-23 ja 230 c/w thermal resistance, 8l-pdip ja 8 5 c / w thermal resistance, 8l-soic ja 163 c/w thermal resistance, 8l-msop ja 206 c/w thermal resistance, 14l-pdip ja 70 c/w thermal resistance, 14l-soic ja 120 c/w thermal resistance, 14l-tssop ja 100 c/w note: the junction temperature (t j ) must not exceed the absolute maximum specification of +150c. v il hi-z t on v ih cs t off v out -0.7 a hi-z i ss i cs 0.7 a 0.7 a -0.7 a -1.0 ma 10 na (typical) (typical) (typical) (typical) (typical) (typical) v dd mcp629x r g r f r n v out v in v dd /2 1f c l r l v l 0.1 f v dd mcp629x r g r f r n v out v dd /2 v in 1f c l r l v l 0.1 f downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 5 mcp6291/1r/2/3/4/5 2.0 typical performance curves note: unless otherwise indicated, t a = +25c, v dd = +2.4v to +5.5v, v ss =gnd, v cm =v dd /2, v out v dd /2, v l = v dd /2, r l =10k to v l , c l = 60 pf, and cs is tied low. figure 2-1: input offset voltage. figure 2-2: input bias current at t a =+85 c. figure 2-3: input offset voltage vs. common mode input voltage at v dd = 2.4v. figure 2-4: input offset voltage drift. figure 2-5: input bias current at t a = +125 c. figure 2-6: input offset voltage vs. common mode input voltage at v dd = 5.5v. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purpose s only. the performance characteristics listed herein are not tested or guaranteed. in so me graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power suppl y range) and therefore outs ide the warranted range. 0% 1% 2% 3% 4% 5% 6% 7% 8% 9% 10% 11% 12% -2.8-2.4 -2.0 -1.6 -1.2 -0.8 -0.4 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 input offset voltage (mv) percentage of occurrences 840 samples v cm = v ss 0% 5% 10% 15% 20% 25% 30% 35% 40% 0 102030405060708090100 input bias current (pa) percentage of occurrences 210 samples t a = 85c 0 50 100 150 200 250 300 350 400 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 common mode input voltage (v) input offset voltage (v) v dd = 2.4v t a = -40c t a = +25c t a = +85c t a = +125c 0% 5% 10% 15% 20% 25% -10 -8-6 -4 -2 02 4 6 8 10 input offset voltage drift (v/c) percentage of occurrences 840 samples v cm = v ss t a = -40c to +125c 0% 5% 10% 15% 20% 25% 30% 0 200400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 input bias current (pa) percentage of occurrences 210 samples t a = +125c 200 250 300 350 400 450 500 550 600 650 700 750 800 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 common mode input voltage (v) input offset voltage (v) v dd = 5.5v t a = +125c t a = +85c t a = +25c t a = -40c downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 6 ? 2007 microchip technology inc. typical performance curves (continued) note: unless otherwise indicated, t a = +25c, v dd = +2.4v to +5.5v, v ss =gnd, v cm =v dd /2, v out v dd /2, v l = v dd /2, r l =10k to v l , c l = 60 pf, and cs is tied low. figure 2-7: input offset voltage vs. output voltage. figure 2-8: cmrr, psrr vs. frequency. figure 2-9: input bias, offs et currents vs. common mode input voltage at t a =+85c. figure 2-10: input bias, input offset currents vs. ambient temperature. figure 2-11: cmrr, psrr vs. ambient temperature. figure 2-12: input bias, offset currents vs. common mode input voltage at t a = +125c. 100 150 200 250 300 350 400 450 500 550 600 650 700 0.00.51.01.52.02.53.03.54.04.55.05.5 output voltage (v) input offset voltage (v) v cm = v ss representative part v dd = 5.5v v dd = 2.4v 20 30 40 50 60 70 80 90 100 110 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 1.e+06 frequency (hz) cmrr, psrr (db) 1 10k 100k 1m 100 10 1k psrr+ psrr- cmrr -25 -15 -5 5 15 25 35 45 55 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 common mode input voltage (v) input bias, offset currents (pa) t a = +85c v dd = 5.5v input bias current input offset current 1 10 100 1,000 10,000 25 35 45 55 65 75 85 95 105 115 125 ambient temperature (c) input bias, offset currents (pa) input bias current input offset current v cm = v dd v dd = 5.5v 60 70 80 90 100 110 120 -50 -25 0 25 50 75 100 125 ambient temperature (c) psrr, cmrr (db) psrr v cm = v ss cmrr -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 common mode input voltage (v) input bias, offset currents (na) t a = +125c v dd = 5.5v input bias current input offset current downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 7 mcp6291/1r/2/3/4/5 typical performance curves (continued) note: unless otherwise indicated, t a = +25c, v dd = +2.4v to +5.5v, v ss =gnd, v cm =v dd /2, v out v dd /2, v l = v dd /2, r l =10k to v l , c l = 60 pf, and cs is tied low. figure 2-13: quiescent current vs. power supply voltage. figure 2-14: open-loop gain, phase vs. frequency. figure 2-15: maximum output voltage swing vs. frequency. figure 2-16: output voltage headroom vs. output current magnitude. figure 2-17: gain bandwidth product, phase margin vs. ambient temperature. figure 2-18: slew rate vs. ambient temperature. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 power supply voltage (v) quiescent current (ma/amplifier) t a = +125c t a = +85c t a = +25c t a = -40c -20 0 20 40 60 80 100 120 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 1.e+08 frequency (hz) open-loop gain (db) -210 -180 -150 -120 -90 -60 -30 0 open-loop phase () gain phase 0.1 1 10 100 1k 10k 100k 1m 10m 100m 0.1 1 10 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 frequency (hz) maximum output voltage swing (v p-p ) 1k 10k 100k 1m 10m v dd = 5.5v v dd = 2.4v 1 10 100 1000 0.01 0.1 1 10 output current magnitude (ma) ouput voltage headroom (mv) v ol - v ss v dd - v oh 0 2 4 6 8 10 12 14 16 -50 -25 0 25 50 75 100 125 ambient temperature (c) gain bandwidth product (mhz) 50 55 60 65 70 75 80 85 90 phase margin () gbwp, v dd = 5.5v gbwp, v dd = 2.4v pm, v dd = 5.5v pm, v dd = 2.4v 0 2 4 6 8 10 12 - 5 0- 2 5 0 2 55 07 51 0 01 2 5 ambient temperature (c) slew rate (v/s) rising edge, v dd = 5.5 v v dd = 2.4 v falling edge, v dd = 5.5 v v dd = 2.4 v downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 8 ? 2007 microchip technology inc. typical performance curves (continued) note: unless otherwise indicated, t a = +25c, v dd = +2.4v to +5.5v, v ss =gnd, v cm =v dd /2, v out v dd /2, v l = v dd /2, r l =10k to v l , c l = 60 pf, and cs is tied low. figure 2-19: input noise voltage density vs. frequency. figure 2-20: output short circuit current vs. power supply voltage. figure 2-21: quiescent current vs. chip select (cs ) voltage at v dd = 2.4v (mcp6293 and mcp6295 only). figure 2-22: i nput noise voltage density vs. common mode input voltage at 10 khz. figure 2-23: channel-to-channel separation vs. frequency (mcp6292, mcp6294 and mcp6295 only). figure 2-24: quiescent current vs. chip select (cs ) voltage at v dd = 5.5v (mcp6293 and mcp6295 only). 1 10 100 1,000 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 1.e+06 frequency (hz) input noise voltage density (nv/ hz) 0.1 100 10 1k 100k 10k 1m 1 0 5 10 15 20 25 30 35 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 power supply voltage (v) ouptut short circuit current (ma) t a = +125c t a = +85c t a = +25c t a = -40c 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 chip select voltage (v) quiescent current (ma/amplifier) hysteresis op-amp shuts off here op-amp turns on here v dd = 2.4v cs swept high to low cs swept low to high 0 1 2 3 4 5 6 7 8 9 10 11 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 common mode input voltage (v) input noise voltage density (nv/ hz) f = 10 khz v dd = 5.0v 100 110 120 130 140 11 01 0 0 frequency (khz) channel-to-channel separation (db) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.00.51.01.52.02.53.03.54.04.55.05.5 chip select voltage (v) quiescent current (ma/amplifier) hysteresis v dd = 5.5v cs swept low to high cs swept high to low op amp shuts off op amp turns on downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 9 mcp6291/1r/2/3/4/5 typical performance curves (continued) note: unless otherwise indicated, t a = +25c, v dd = +2.4v to +5.5v, v ss =gnd, v cm =v dd /2, v out v dd /2, v l = v dd /2, r l =10k to v l , c l = 60 pf, and cs is tied low. figure 2-25: large-signal non-inverting pulse response. figure 2-26: small-signal non-inverting pulse response. figure 2-27: chip select (cs ) to amplifier output re sponse time at v dd = 2.4v (mcp6293 and mcp6295 only). figure 2-28: large-signal inverting pulse response. figure 2-29: small-signal inverting pulse response. figure 2-30: chip select (cs ) to amplifier output re sponse time at v dd = 5.5v (mcp6293 and mcp6295 only). 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.e+00 1.e-06 2.e-06 3.e-06 4.e-06 5.e-06 6.e-06 7.e-06 8.e-06 9.e-06 1.e- 05 time (1 s/div) output voltage (v) g = +1v/v v dd = 5.0v time (200 ns/div) output voltage (10 mv/div) g = +1v/v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.e+00 5.e-06 1.e-05 2.e-05 2.e-05 3.e-05 3.e-05 4.e-05 4.e-05 5.e-05 5.e-05 time (5 s/div) chip select, output voltages (v) v out output on output high-z v dd = 2.4 v g = +1v/ v v in = v ss cs voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.e+00 1.e-06 2.e-06 3.e-06 4.e-06 5.e-06 6.e-06 7.e-06 8.e-06 9.e-06 1.e-05 time (1 s/div) output voltage (v) g = -1v/v v dd = 5.0v time (200 ns/div) output voltage (10 mv/div) g = -1v/v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.e+00 5.e-06 1.e-05 2.e-05 2.e-05 3.e-05 3.e-05 4.e-05 4.e-05 5.e-05 5.e- 05 time (5 s/div) chip select, output voltages (v) v out output high-z v dd = 5.5 v g = +1v/ v v in = v ss cs voltage output on downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 10 ? 2007 microchip technology inc. typical performance curves (continued) note: unless otherwise indicated, t a = +25c, v dd = +2.4v to +5.5v, v ss =gnd, v cm =v dd /2, v out v dd /2, v l = v dd /2, r l =10k to v l , c l = 60 pf, and cs is tied low. figure 2-31: measured input current vs. input voltage (below v ss ). figure 2-32: the mcp6291/1r/2/3/4/5 show no phase reversal. 1.e-12 1.e-11 1.e-10 1.e-09 1.e-08 1.e-07 1.e-06 1.e-05 1.e-04 1.e-03 1.e-02 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 input voltage (v) input current magnitude (a) +125c +85c +25c -40c 10m 1m 100 10 1 100n 10n 1n 100p 10p 1p -1 0 1 2 3 4 5 6 -15 -14 -13 -12 -11 -10 -9 -8 -7 -6 -5 time (1 ms/div) input, output voltage (v) v dd = 5.0v g = +2v/v v in v out downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 11 mcp6291/1r/2/3/4/5 3.0 pin descriptions descriptions of the pins are listed in table 3-1 (single op amps) and table 3-2 (dual and quad op amps). table 3-1: pin function table for single op amps table 3-2: pin function table for dual and quad op amps 3.1 analog outputs the output pins are low-impedance voltage sources. 3.2 analog inputs the non-inverting and inverting inputs are high- impedance cmos inputs with low bias currents. 3.3 mcp6295s v outa /v inb + pin for the mcp6295 only, the output of op amp a is connected directly to the non-inverting input of op amp b; this is the v outa /v inb + pin. this connection makes it possible to provide a chip select pin for duals in 8-pin packages. 3.4 chip select digital input this is a cmos, schmitt-triggered input that places the part into a low power mode of operation. 3.5 power supply pins the positive power supply (v dd ) is 2.4v to 6.0v higher than the negative power supply (v ss ). for normal operation, the other pins are between v ss and v dd . typically, these parts are used in a single (positive) supply configuration. in this case, v ss is connected to ground and v dd is connected to the supply. v dd will need bypass capacitors mcp6291 mcp6291r mcp6293 symbol description pdip, soic, msop sot-23-5 pdip, soic, msop sot-23-6 61 1 61v out analog output 24 4 24v in C inverting input 33 3 33v in + non-inverting input 75 2 76v dd positive power supply 42 5 42v ss negative power supply 8 5c s chip select 1,5,8 1,5 nc no internal connection mcp6292 mcp6294 mcp6295 symbol description 11v outa analog output (op amp a) 222 v ina C inverting input (op amp a) 333 v ina + non-inverting input (op amp a) 848 v dd positive power supply 55v inb + non-inverting input (op amp b) 666 v inb C inverting input (op amp b) 777v outb analog output (op amp b) 8v outc analog output (op amp c) 9 v inc C inverting input (op amp c) 1 0 v inc + non-inverting input (op amp c) 41 14 v ss negative power supply 1 2 v ind + non-inverting input (op amp d) 1 3 v ind C inverting input (op amp d) 1 4 v outd analog output (op amp d) 1v outa /v inb + analog output (op amp a)/non-inverting input (op amp b) 5 c s chip select downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 12 ? 2007 microchip technology inc. 4.0 application information the mcp6291/1r/2/3/4/5 family of op amps is manufactured using microchi ps state of the art cmos process, specifically designed for low-cost, low-power and general purpose applications. the low supply voltage, low quiescent current and wide bandwidth makes the mcp6291/1r/2/3/4/5 ideal for battery-pow- ered applications. 4.1 rail-to-rail inputs 4.1.1 phase reversal the mcp6291/1r/2/3/4/5 op amp is designed to prevent phase reversal when the input pins exceed the supply voltages. figure 2-32 shows the input voltage exceeding the supply voltage without any phase rever- sal. 4.1.2 input voltage and current limits the esd protection on the inputs can be depicted as shown in figure 4-1 . this structure was chosen to protect the input transistors, and to minimize input bias current (i b ). the input esd diodes clamp the inputs when they try to go more than one diode drop below v ss . they also clamp any voltages that go too far above v dd ; their breakdown voltage is high enough to allow normal operation, and low enough to bypass quick esd events within the specified limits. figure 4-1: simplified analog input esd structures. in order to prevent damage and/or improper operation of these op amps, the circuit they are in must limit the currents and voltages at the v in + and v in C pins (see absolute maxi mum ratings ? at the beginning of section 1.0 electri cal characteristics ). figure 4-2 shows the recommended approach to protecting these inputs. the internal esd diodes prevent the input pins (v in + and v in C) from going too far below ground, and the resistors r 1 and r 2 limit the possible current drawn out of the input pins. diodes d 1 and d 2 prevent the input pins (v in + and v in C) from going too far above v dd , and dump any currents onto v dd . when implemented as shown, resistors r 1 and r 2 also limit the current through d 1 and d 2 . figure 4-2: protecting the analog inputs. it is also possible to connect the diodes to the left of the resistor r 1 and r 2 . in this case, the currents through the diodes d 1 and d 2 need to be limited by some other mechanism. the resistors th en serve as in-rush current limiters; the dc current into the input pins (v in + and v in C) should be very small. a significant amount of current can flow out of the inputs when the common mode voltage (v cm ) is below ground (v ss ); see figure 2-31 . applications that are high impedance may need to limit the usable voltage range. 4.1.3 normal operation the input stage of the mcp6291/1r/2/3/4/5 op amps use two differential cmos input stages in parallel. one operates at low common mode input voltage (v cm ), while the other oper ates at high v cm . with this topol- ogy, the device operates with v cm up to 0.3v past either supply rail. the input offset voltage (v os ) is mea- sured at v cm = v ss - 0.3v and v dd + 0.3v to ensure proper operation. the transition between the two input stages occurs when v cm = v dd - 1.1v. for the best distortion and gain linearity, with non-inverting gains, avoid this region of operation. 4.2 rail-to-rail output the output voltage range of the mcp6291/1r/2/3/4/5 op amp is v dd C 15 mv (min.) and v ss +15mv (maximum) when r l =10k is connected to v dd /2 and v dd = 5.5v. refer to figure 2-16 for more information. bond pad bond pad bond pad v dd v in + v ss input stage bond pad v in C v 1 mcp629x r1 v dd d1 r 1 > v ss C (minimum expected v1) 2ma v out r 2 > v ss C (minimum expected v2) 2ma v 2 r2 d2 downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 13 mcp6291/1r/2/3/4/5 4.3 capacitive loads driving large capacitive loads can cause stability problems for voltage feedback op amps. as the load capacitance increases, the feedback loops phase margin decreases and the closed-loop bandwidth is reduced. this produces gain peaking in the frequency response, with overshoot and ringing in the step response. a unity-gain buffer (g = +1) is the most sensitive to capacitive loads, though all gains show the same general behavior. when driving large capacitive loads with these op amps (e.g., > 100 pf when g = +1), a small series resistor at the output (r iso in figure 4-3 ) improves the feedback loops phase margin (stability) by making the output load resistive at higher frequencies. the bandwidth will be generally lower than the bandwidth with no capacitive load. figure 4-3: output resistor, r iso stabilizes large capacitive loads. figure 4-4 gives recommended r iso values for different capacitive loads and gains. the x-axis is the normalized load capacitance (c l /g n ), where g n is the circuit's noise gain. for non-inverting gains, g n and the signal gain are equal. for inverting gains, g n is 1+|signal gain| (e.g., -1 v/v gives g n = +2 v/v). figure 4-4: recommended r iso values for capacitive loads. after selecting r iso for your circuit, double-check the resulting frequency response peaking and step response overshoot. modify r iso 's value until the response is reasonable. bench evaluation and simulations with the mcp6291/1r/2/3/4/5 spice macro model are helpful. 4.4 mcp629x chip select the mcp6293 and mcp6295 are single and dual op amps with chip select (cs ), respectively. when cs is pulled high, the supply current drops to 0.7 a (typical) and flows through the cs pin to v ss . when this happens, the amplifier output is put into a high-imped- ance state. by pulling cs low, the amplifier is enabled. the cs pin has an internal 5 m (typical) pull-down resistor connected to v ss , so it will go low if the cs pin is left floating. figure 1-1 shows the output voltage and supply current response to a cs pulse. 4.5 cascaded dual op amps (mcp6295) the mcp6295 is a dual op amp with chip select (cs ). the chip select input is available on what would be the non-inverting input of a standard dual op amp (pin 5). this is available because the output of op amp a connects to the non-inverting input of op amp b, as shown in figure 4-5 . the chip select input, which can be connected to a microcontroller i/o line, puts the device in low-power mode. refer to section 4.4 mcp629x chip select . figure 4-5: cascaded gain amplifier. the output of op amp a is loaded by the input imped- ance of op amp b, which is typically 10 13 || 6pf, as specified in the dc specification table (refer to section 4.3 capacitive loads for further details regarding capacitive loads). the common mode input range of these op amps is specified in the data sheet as v ss C 300 mv and v dd + 300 mv. however, since the output of op amp a is limited to v ol and v oh (20 mv from the rails with a 10 k load), the non-inverting input range of op amp b is limited to the common mode input range of v ss + 20 mv and v dd C20mv. v in r iso v out c l C + mcp629x 10 100 10 100 1,000 10,000 normalized load capacitance; c l /g n (pf) recommended r iso ( ? ) g n = 1 v/v g n 2 v/v a b cs 23 5 6 7 v ina+ v outb mcp6295 1 v inaC v outa /v inb+ v inbC downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 14 ? 2007 microchip technology inc. 4.6 supply bypass with this family of operat ional amplifiers, the power supply pin (v dd for single supply) should have a local bypass capacitor (i.e., 0.01 f to 0.1 f) within 2 mm for good high-frequency performance. it also needs a bulk capacitor (i.e., 1 f or larger) within 100 mm to provide large, slow currents. this bulk capacitor can be shared with nearby analog parts. 4.7 unused op amps an unused op amp in a quad package (mcp6294) should be configured as shown in figure 4-6 . these circuits prevent the output from toggling and causing crosstalk. circuits a sets the op amp at its minimum noise gain. the resistor divider produces any desired reference voltage within the ou tput voltage range of the op amp; the op amp buffers that reference voltage. circuit b uses the minimum number of components and operates as a comparator, but it may draw more current. figure 4-6: unused op amps. 4.8 pcb surface leakage in applications where low input bias current is critical, printed circuit board (pcb) surface-leakage effects need to be considered. surf ace leakage is caused by humidity, dust or other contamination on the board. under low humidity conditions, a typical resistance between nearby traces is 10 12 . a 5v difference would cause 5 pa of current to flow, which is greater than the mcp6291/1r/2/3/4/5 familys bias current at 25c (1 pa, typical). the easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). the guard ring is biased at the same voltage as the sensitive pin. an example of this type of layout is shown in figure 4-7 . figure 4-7: example guard ring layout for inverting gain. 1. for inverting gain and transimpedance amplifiers (convert current to voltage, such as photo detectors): a. connect the guard ring to the non-inverting input pin (v in +). this biases the guard ring to the same reference voltage as the op amp (e.g., v dd /2 or ground). b. connect the inverting pin (v in C) to the input with a wire that does not touch the pcb surface. 2. non-inverting gain and unity-gain buffer: a. connect the non-inverting pin (v in +) to the input with a wire that does not touch the pcb surface. b. connect the guard ring to the inverting input pin (v in C). this biases the guard ring to the common mode input voltage. v dd v dd ? mcp6294 (a) ? mcp6294 (b) r 1 r 2 v dd v ref v ref v dd r 2 r 1 r 2 + ------------------ ? = guard ring v ss v in Cv in + downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 15 mcp6291/1r/2/3/4/5 4.9 application circuits 4.9.1 multiple feedback low-pass filter the mcp6291/1r/2/3/4/5 op amp can be used in active-filter applications. figure 4-8 shows an inverting, third-order, multiple feedback low-pass filter that can be used as an anti-aliasing filter. figure 4-8: multiple feedback low- pass filter. this filter, and others, can be designed using microchips filter design software. refer to section 5.0 design aids 4.9.2 photodiod e amplifier figure 4-9 shows a photodiode biased in the photovol- taic mode for high precision. the resistor r converts the diode current i d to the voltage v out . the capacitor is used to limit the bandwidth or to stabilize the circuit against the diodes capacitance (it is not always needed). figure 4-9: photodiode amplifier. 4.9.3 cascaded op amp applications the mcp6295 provides the flexibility of low-power mode for dual op amps in an 8-pin package. the mcp6295 eliminates the added cost and space in battery-powered applications by using two single op amps with chip select lines or a 10-pin device with one chip select line for both op amps. since the two op amps are internally cascaded, this device cannot be used in circuits that require active or passive elements between the two op amps. however, there are several applications where this op amp configuration with chip select line becomes suitable. the circuits below show possible applications for this device. 4.9.3.1 load isolation with the cascaded op amp configuration, op amp b can be used to isolate the load from op amp a. in applica- tions where op amp a is driving capacitive or low resistance loads in the feedback loop (such as an integrator circuit or filter circuit), the op amp may not have sufficient source current to drive the load. in this case, op amp b can be used as a buffer. figure 4-10: isolating the load with a buffer. mcp6291 v out v in v dd /2 r 3 c 3 c 1 r 1 r 2 c 4 r 4 mcp6291 v out i d v dd /2 r c light a b mcp6295 cs v outb load downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 16 ? 2007 microchip technology inc. 4.9.3.2 cascaded gain figure 4-11 shows a cascaded gain circuit configura- tion with chip select. op amps a and b are configured in a non-inverting amplifier c onfiguration. in this config- uration, it is important to note that the input offset volt- age of op amp a is amplified by the gain of op amp a and b, as shown below: therefore, it is recommende d to set most of the gain with op amp a and use op amp b with relatively small gain (e.g., a unity-gain buffer). figure 4-11: cascaded gain circuit configuration. 4.9.3.3 difference amplifier figure 4-12 shows op amp a as a difference amplifier with chip select. in this configuration, it is recommended to use well-matched resistors (e.g., 0.1%) to increase the common mode rejection ratio (cmrr). op amp b can be used for additional gain or as a unity-gain buffer to isolate the load from the difference amplifier. figure 4-12: difference amplifier circuit. 4.9.3.4 buffered non-inverting integrator figure 4-13 shows a lossy non-inverting integrator that is buffered and has a chip select input. op amp a is configured as a non-inverting integrator. in this config- uration, matching the impedance at each input is recommended. r f is used to provide a feedback loop at frequencies << 1/(2 r 1 c 1 ) and makes this a lossy integrator (it has a finite gain at dc). op amp b is used to isolate the load from the integrator. figure 4-13: buffered non-inverting integrator with chip select. 4.9.3.5 inverting int egrator with active compensation and chip select figure 4-14 uses an active compensator (op amp b) to compensate for the non-ideal op amp characteristics introduced at higher frequencies. this circuit uses op amp b as a unity-gain buffer to isolate the integration capacitor c 1 from op amp a and drives the capacitor with low-impedance source. since both op amps are matched very well, they provide a high quality integrator. figure 4-14: integrator circuit with active compensation. v out v in g a g b v osa g a g b v osb g b + + = where: g a = op amp a gain g b = op amp b gain v osa = op amp a input offset voltage v osb = op amp b input offset voltage a b cs r 4 r 3 r 2 r 1 v in v out mcp6295 a b cs r 2 r 1 v in2 v in1 r 2 r 1 v out r 4 r 3 mcp6295 a b cs r f c 1 r 2 c 2 r 1 v in v out mcp6295 r 1 c 1 r 2 r f || () c 2 = a cs b v in v out r 1 c 1 mcp6295 downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 17 mcp6291/1r/2/3/4/5 4.9.3.6 second-order mfb low-pass filter with an extra pole-zero pair figure 4-15 is a second-order multiple feedback low- pass filter with chip select. use the filterlab ? software from microchip to determine the r and c values for the op amp as second-order filter. op amp b can be used to add a pole-zero pair using c 3 , r 6 and r 7 . figure 4-15: second-order multiple feedback low-pass filter with an extra pole- zero pair. 4.9.3.7 second-order sallen-key low-pass filter with an extra pole-zero pair figure 4-16 is a second-order, sallen-key low-pass filter with chip sele ct. use the filterlab ? software from microchip to determine the r and c values for the op amp as second-order filter. op amp b can be used to add a pole-zero pair using c 3 , r 5 and r 6 . figure 4-16: second-order sallen-key low-pass filter wit h an extra pole-zero pair and chip select. 4.9.3.8 capacitorless second-order low-pass filter with chip select the low-pass filter shown in figure 4-17 does not require external capacitors and uses only three external resistors; the op amps gbwp sets the corner frequency. r 1 and r 2 are used to set the circuit gain and r 3 is used to set the q. to avoid gain peaking in the frequency response, q needs to be low (lower values need to be selected for r 3 ). note that the amplifier bandwidth varies greatly over temperature and process. however, this configuration provides a low cost solution for applications with high bandwidth requirements. figure 4-17: capacitorless second-order low-pass filter wit h chip select. a b cs r 1 c 1 r 5 v in v out c 2 r 4 r 3 r 2 r 6 c 3 mcp6295 r 7 a b cs r 2 c 1 r 1 v in v out r 4 r 3 c 2 c 3 r 5 mcp6295 r 6 a b cs v ref v in v out r 2 r 1 r 3 mcp6295 downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 18 ? 2007 microchip technology inc. 5.0 design aids microchip provides the basic design tools needed for the mcp6291/1r/2/3/4/5 family of op amps. 5.1 spice macro model the latest spice macro model for the mcp6291/1r/2/ 3/4/5 op amps is available on the microchip web site at www.microchip.com. this model is intended to be an initial design tool that works well in the op amps linear region of operation over t he temperature range. see the model file for information on its capabilities. bench testing is a very important part of any design and cannot be replaced with simulations. also, simulation results using this macro model need to be validated by comparing them to the data sheet specifications and characteristic curves. 5.2 filterlab ? software microchips filterlab ? software is an innovative software tool that simplifies analog active filter (using op amps) design. available at no cost from the microchip web site at www.m icrochip.com/filterlab, the filterlab design tool prov ides full schematic diagrams of the filter circuit with component values. it also outputs the filter circuit in spice format, which can be used with the macro model to simulate actual filter performance. 5.3 mindi? simulator tool microchips mindi? simulator tool aids in the design of various circuits useful for active filter, amplifier and power-management applications. it is a free online simulation tool available from the microchip web site at www.microchip.com/mindi. this interactive simulator enables designers to quickly generate circuit diagrams, simulate circuits. circuits developed using the mindi simulation tool can be downloaded to a personal computer or workstation. 5.4 maps (microchip advanced part selector) maps is a software tool that helps semiconductor professionals efficiently id entify microchip devices that fit a particular design requirement. available at no cost from the microchip web site at www.microchip.com/ maps, the maps is an over all selection tool for microchips product portfolio that includes analog, memory, mcus and dscs. using this tool you can define a filter to sort features for a parametric search of devices and export side-by-side technical comparison reports. helpful links are also provided for data sheets, purchase, and sampling of microchip parts. 5.5 analog demonstration and evaluation boards microchip offers a broad spectrum of analog demon- stration and evaluation boar ds that are designed to help you achieve faster time to market. for a complete listing of these boards and their corresponding users guides and technical information, visit the microchip web site at www.microchip.com/analogtools. two of our boards that are especially useful are: p/n soic8ev: 8-pin soic/msop/tssop/dip evaluation board p/n soic14ev: 14-pin soic/tssop/dip evalu- ation board 5.6 application notes the following microchip application notes are avail- able on the microchip web site at www.microchip. com/ appnotes and are recommended as supplemental ref- erence resources. adn003: select the right operational amplifier for your filtering circuits, ds21821 an722: operational amplifier topologies and dc specifications, ds00722 an723: operational amplifier ac specifications and applications, ds00723 an884: driving capacitive loads with op amps, ds00884 an990: analog sensor conditioning circuits C an overview, ds00990 these application notes and others are listed in the design guide: signal chain design guide, ds21825 downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 19 mcp6291/1r/2/3/4/5 6.0 packaging information 6.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn mcp6291 e/p256 0436 mcp6291 e/sn0436 256 8-lead msop xxxxxx ywwnnn 6291e 436256 5-lead sot-23 ( mcp6291 and mcp6291r ) example: xxnn cj25 device code mcp6291 cjnn mcp6291r evnn note: applies to 5-lead sot-23 6-lead sot-23 ( mcp6283 ) example: xxnn cm25 example: legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e device code mcp6293 cmnn note: applies to 6-lead sot-23 mcp6291 e/p^^256 0743 mcp6291e sn^^0743 256 or or 3 e 3 e downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 20 ? 2007 microchip technology inc. package marking information (continued) 14-lead pdip (300 mil) (mcp6294) example: 14-lead tssop (mcp6294) example: 14-lead soic (150 mil) (mcp6294) example: xxxxxxxxxxxxxx xxxxxxxxxxxxxx yywwnnn xxxxxxxxxx yywwnnn xxxxxx yyww nnn mcp6294 -e/p 0436256 6294 est 0436 256 xxxxxxxxxx mcp6294 esl 0436256 mcp6294 0743256 mcp6294 0436256 oror e/p^^ 3 e e/sl^^ 3 e downloaded from: http:///
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mcp6291/1r/2/3/4/5 ds21812e-page 30 ? 2007 microchip technology inc. notes: downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 31 mcp6291/1r/2/3/4/5 appendix a: revision history revision e (november 2007) the following is the list of modifications: 1. updated notes to section 1.0 electrical char- acteristics . increased absolute maximum volt- age range of input pins. increased maximum operating supply voltage (v dd ). 2. added test circuits. 3. added figure 2-31 and figure 2-32. 4. added section 4.1.1 phase reversal , section 4.1.2 input voltage and current limits , and section 4.1.3 normal opera- tion . 5. added section 4.7 unused op amps . 6. updated section 5.0 design aids . 7. corrected package markings. 8. updated package outline drawing. revision d (december 2004) the following is the list of modifications: 1. added sot-23-5 packages for the mcp6291 and mcp6291r single op amps. 2. added sot-23-6 package for the mcp6293 single op amp. 3. added section 3.0 pin descriptions . 4. corrected application circuits ( section 4.9 application circuits ). 5. added sot-23-5 and sot-23-6 packages and corrected package marking information ( section 6.0 packaging information ). 6. added appendix a: revision history. revision c (june 2004) undocumented changes. revision b (october 2003) undocumented changes. revision a (june 2003) original data sheet release. downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 32 ? 2007 microchip technology inc. notes: downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 33 mcp6291/1r/2/3/4/5 product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . device: mcp6291: single op amp mcp6291t: single op amp (tape and reel) (soic, msop, sot-23-5) mcp6291rt: single op amp (tape and reel) (sot-23-5) mcp6292: dual op amp mcp6292t: dual op amp (tape and reel) (soic, msop) mcp6293: single op amp with chip select mcp6293t: single op amp with chip select (tape and reel) (soic, msop, sot-23-6) mcp6294: quad op amp mcp6294t: quad op amp (tape and reel) (soic, tssop) mcp6295: dual op amp with chip select mcp6295t: dual op amp with chip select (tape and reel) (soic, msop) temperature range: e = -40 c to +125 c package: ot = plastic small outline transistor (sot-23), 5-lead (mcp6291, mcp6291r) ch = plastic small outline transistor (sot-23), 6-lead (mcp6293) ms = plastic msop, 8-lead p = plastic dip (300 mil body), 8-lead, 14-lead sn = plastic soic, (3.90 mm body), 8-lead sl = plastic soic (3.90 mm body), 14-lead st = plastic tssop (4.4 mm body), 14-lead part no. x /xx package temperature range device examples: a) mcp6291-e/sn: extended temperature, 8 lead soic package. b) mcp6291-e/ms: extended temperature, 8 lead msop package. c) mcp6291-e/p: extended temperature, 8 lead pdip package. d) mcp6291t-e/ot: tape and reel, extended temperature, 5 lead sot-23 package. e) mcp6291rt-e/ot: tape and reel, extended temperature, 5 lead sot-23 package. a) mcp6292-e/sn: extended temperature, 8 lead soic package. b) mcp6292-e/ms: extended temperature, 8 lead msop package. c) mcp6292-e/p: extended temperature, 8 lead pdip package. d) mcp6292t-e/sn: tape and reel, extended temperature, 8 lead soic package. a) mcp6293-e/sn: extended temperature, 8 lead soic package. b) mcp6293-e/ms: extended temperature, 8 lead msop package. c) mcp6293-e/p: extended temperature, 8 lead pdip package. d) mcp6293t-e/ch: tape and reel, extended temperature, 6 lead sot-23 package. a) mcp6294-e/p: extended temperature, 14 lead pdip package. b) mcp6294t-e/sl: tape and reel, extended temperature, 14 lead soic package. c) mcp6294-e/sl: extended temperature, 14 lead soic package. d) mcp6294-e/st: extended temperature, 14 lead tssop package. a) mcp6295-e/sn: extended temperature, 8 lead soic package. b) mcp6295-e/ms: extended temperature, 8 lead msop package. c) mcp6295-e/p: extended temperature, 8 lead pdip package. d) mcp6295t-e/sn: tape and reel, extended temperature, 8 lead soic package. C downloaded from: http:///
mcp6291/1r/2/3/4/5 ds21812e-page 34 ? 2007 microchip technology inc. notes: downloaded from: http:///
? 2007 microchip technology inc. ds21812e-page 35 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , k ee l oq logo, micro id , mplab, pic, picmicro, picstart, pro mate, rfpic and smartshunt are registered trademarks of microc hip technology incorporated in the u.s.a. and other countries. amplab, filterlab, linear active thermistor, migratable memory, mxdev, mxlab, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip te chnology incorporated in the u.s.a. analog-for-the-digital age, application maestro, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, mindi, miwi, mpasm, mplab certified logo, mplib, mplink, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, real ice, rflab, select mode, smart serial, smarttel, total endurance, uni/o, wiperlock and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2007, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchips c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwa re or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the companys quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperi pherals, nonvolatile memory and analog products. in addition, microchips quality system for the design and manufacture of development systems is iso 9001:2000 certified. downloaded from: http:///
ds21812e-page 36 ? 2007 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://support.microchip.com web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 kokomo kokomo, in tel: 765-864-8360 fax: 765-864-8387 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8528-2100 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - fuzhou tel: 86-591-8750-3506 fax: 86-591-8750-3521 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - shunde tel: 86-757-2839-5507 fax: 86-757-2839-5571 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 asia/pacific india - bangalore tel: 91-80-4182-8400 fax: 91-80-4182-8422 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-572-9526 fax: 886-3-572-6459 taiwan - kaohsiung tel: 886-7-536-4818 fax: 886-7-536-4803 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 w orldwide s ales and s ervice 10/05/07 downloaded from: http:///


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